Revolutionize Your Solder Mask Printing with GIS Tech's Advanced LDI Technology

In the dynamic world of PCB (Printed Circuit Board) manufacturing, precision and efficiency are paramount. GIS Tech introduces its state-of-the-art Solder Mask LDI (Laser Direct Imaging) systems, designed to transform your production processes and elevate the quality of your solder mask applications to unprecedented heights.

Unmatched Precision with Solder Mask LDI

GIS Tech's Solder Mask LDI systems utilize cutting-edge laser technology to directly image solder mask patterns onto PCBs with exceptional accuracy. This eliminates the need for traditional photolithography methods, reducing errors and enhancing the fine-line capabilities essential for modern high-density PCB designs.

High Production Capacity

With a high-efficiency design, our Solder Mask LDI systems boast an impressive production capacity. Capable of processing 5280 panels in just 22 hours with two machines inline, these systems ensure your production lines keep pace with demand, without compromising on quality.

Versatile Ink Compatibility

Our Solder Mask LDI systems are compatible with multiple types of solder mask inks, including green, blue, black, red, and white. This flexibility allows you to meet diverse customer requirements and expand your service offerings.

Advanced Scaling and Alignment Features

GIS Tech's Solder Mask LDI systems offer multiple options for scale and higher alignment accuracy. Whether you need auto-scale, fixed-scale, or measurement-scale functions, our systems provide the precision required for complex PCB designs. With inner layer overlay accuracy of 10μm and outer layer alignment accuracy of ±5μm, you can trust in the consistency and reliability of our technology.

Comprehensive Application Coverage

Our Solder Mask LDI systems support a wide range of applications, including substrates, HDI, FPC, and PCBs. With models tailored for single-stage, twin-stage, and R/D (Research and Development) processes, GIS Tech has the perfect solution for every stage of your production cycle.

Technical Specifications

• Laser Options: Multiple laser wavelengths and power levels to suit various material and application needs.
• Max Size & Resolution: Capable of handling large PCB sizes with high resolution, ensuring fine details are accurately reproduced.
• Throughput: High-speed processing capabilities to maximize productivity.
• Line Width Tolerance: Maintain tight tolerances for critical circuit features.
• DOF (Depth of Focus): Ensures consistent imaging quality across varying substrate thicknesses.

Why Choose GIS Tech's Solder Mask LDI Systems?

• Innovation: Stay ahead of the competition with the latest in LDI technology.
• Efficiency: Reduce production times and increase output with high-capacity systems.
• Quality: Achieve superior print quality and precision, meeting the highest industry standards.
• Flexibility: Adapt to a wide range of materials and applications with ease.

Embrace the future of PCB manufacturing with GIS Tech's Solder Mask LDI systems. Elevate your production capabilities, reduce costs, and deliver exceptional quality to your customers. Contact us today to learn more about how our LDI solutions can transform your business.